Solution

Space-borne systems require radiation-hardened (rad-hard) components to survive ionizing radiation in low Earth orbit (LEO), geostationary orbit (GEO), and deep space. Key components include:

On-Board Processing (OBP):

Rad-Hard Processors: BAE Systems RAD750 (PowerPC-based, 200MHz clock, total ionizing dose [TID] tolerance >300krad(Si), single-event upset [SEU] rate <1e-10/bit-day)—powers satellite payload processing (e.g., image compression, data routing) for 15+ year missions.

Rad-Hard FPGAs: Microchip RTG4 (Xilinx-based, 1.5M logic cells, TID tolerance >100krad(Si), SEL immunity >100MeV·cm²/mg)—supports reconfigurable payloads (e.g., software-defined radios) and complies with ECSS-Q-60-10 for space applications.

Payload & Science Instruments:

Imaging Sensors: Teledyne e2v EV76C560 (rad-hard CCD, 2048×2048 resolution, quantum efficiency >90% at 550nm, TID tolerance >50krad(Si))—captures high-resolution Earth observation or deep-space imagery (e.g., Mars rover cameras).

Spectral Sensors: Analog Devices AD7768 (24-bit Σ-Δ ADC, sampling rate 256kSPS, noise density <1nV/√Hz, TID tolerance >100krad(Si))—enables scientific measurements (e.g., atmospheric composition, cosmic radiation detection) with sub-microvolt precision.

Energy & Thermal Management:

Solar Array Controllers: Maxim MAX17573 (MPPT efficiency >98%, input voltage 22–32V, output current 10A, TID tolerance >50krad(Si))—optimizes power harvest from solar panels in varying sunlight conditions (e.g., LEO eclipse periods).

Thermal Control ICs: Linear Technology LT3652 (rad-hard DC-DC converter, input 4–36V, output 1.2–15V, operating temperature -55℃ to 125℃)—powers heater elements to maintain payload temperatures within ±0.5℃, critical for sensor accuracy.