
Core Technical AdvantagesRF Front-End Modules (RF FEMs)—integrated assemblies that combine key 射频 components (power amplifiers, PAs; low-noise amplifiers, LNAs; switches, filters, and antennas) into a single compact package—are the backbone of 5G/…

Core Technical AdvantagesHigh-precision data conversion chips—including Analog-to-Digital Converters (ADCs) and Digital-to-Analog Converters (DACs) with resolution ≥16 bits and low noise performance—serve as the critical interface between the physi…

Core Technical AdvantagesHigh-performance MCUs (Microcontroller Units) with integrated AI accelerators—compact, low-power computing devices that combine a general-purpose CPU core (e.g., Arm Cortex-M7/M85), memory (RAM/Flash), peripherals (ADC, UART,…